Electroforming anode shields

ABSTRACT

Anode shields are provided around the anode baskets in an electroforming process.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a division of application Ser. No. 395,869, filed Sept. 10, 1973, entitled ELECTROFORMING ANODE SHIELDS, now abandoned.

BACKGROUND OF THE INVENTION

One of the principal steps in the process of manufacturing a printed circuit board is the electroforming or electroplating of a conductor such as nickel in holes drilled through the board. For example, the basic process of producing a unitube printed circuit board involves the drilling of holes in an epoxy fiber glass board/aluminum laminate, electroforming nickel in the holes, and then dissolving the aluminum to leave the nickel tubes protruding from the board. These protruding tubes can then serve as the basis for the attachment of leads to the board by means such as welding. Thus, the thickness, hardness and ductility of the tubes must be favorably disposed to produce acceptable welds.

While various methods and devices have been developed to produce unitubes having uniform plating thickness across the board together with tubes having the necessary weldable qualities, each present solution appears to have certain inherent limitations and/or drawbacks. For example, it has been found that cathode shields, such as described in U.S. Pat. No. 3,429,786 have the disadvantage of using considerable space in the electroforming tank and require assembly to the cathode before the plating operation. Also, these shields tend to restrict agitation of the electroforming solution across the face of the cathode and thus may increase pitting of the electrodeposit. Such shields provide shielding for the redundant side only. Therefore, after the initial plating time, the operator must place the two plating racks face to face in order to prevent overgrowth of the circuits and to continue building up the circuits. This causes inferior plating on the surface due to the low current density. Attempts to improve the plating uniformity and unitube ductility by varying the constituents in the nickel sulfamate plating solution and by varying the conditions of temperature, time, pH, and current density did not provide satisfactory results.

Examples of unitube manufacturing processes which might utilize the present invention are disclosed in U.S. Pat. Nos. 3,370,351, 3,396,459, 3,426,427, 3,429,036, 3,429,037, 3,429,038, 3,431,641, 3,462,832 and 3,508,330 plus U.S. Ser. No. 329,798 filed Feb. 5, 1973, now U.S. Pat. No. 3,819,430, and U.S. Ser. No. 374,747 filed June 28, 1973, now U.S. Pat. No. 3,855,692.

SUMMARY OF THE INVENTION

In the electroforming process of plating a conductive material in a hole in a printed circuit board, the anode is shielded to accurately control the anode current density. By increasing the current density of the shielded anode, weldable tubes can be produced on the printed circuit boards.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view illustrating an embodiment of the present invention looking towards the true circuit side of the printed circuit board: and

FIG. 2 is a view of the FIG. 1 embodiment looking towards the redundant circuit side of the printed circuit board.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the electroforming or electroplating of a conductor such as nickel on a printed circuit board, the board is arranged on a cathode bar and immersed in a sulfamate nickel plating solution together with an anode basket. Applying current to the anode and cathode will plate the nickel on the printed circuit board. While plating thickness is basically a function of time and current (ampere-hour) in the plating solution, other factors require important consideration to repeatably produce an acceptable product. For example, hardness and ductility must be controlled to prevent cracking of the tube during subsequent welding. A deposit hardness not exceeding 30 Rockwell C when using a 500 gram load on the Tukon tester has been found to be satisfactory.

As shown in FIGS. 1 and 2, two printed circuit boards 10 and 12 are suspended from a frame 14 by means of clips 16 and 18 respectively. The frame 14 is supported from the cathode bar 20 by hooks 22 and 24. A handle 26 is also affixed to the frame 14 to facilitate handling.

The printed circuit boards 10 and 12 have a true circuit side A which is the side on which the finished circuit is to be formed and a redundant circuit side B. The redundant side B is not part of the finished product and is removed, for example by sanding, in a later processing step. Because of circuit spacing and hole diameter requirements, it may be necessary to build up more of a tube thickness (in the drilled hole) through the redundant side B of the board than through the true circuit side A.

A redundant circuit side anode 30 is suspended in the sulfamate nickel plating solution on the redundant circuit side B of the printed circuit boards 10 and 12. Likewise a true circuit side anode 32 is immersed in the solution on the true circuit side A.

Each anode 30 and 32 generally comprises a titanium basket 34 and 36 filled with nickel chips 38 and 40 and suspended by means of anode hooks 42 and 44 respectively. The sulfamate nickel plating solution may comprise the following:

Nickel (as nickel sulfamate): 75-100 grams/liter

Nickel Chloride: 10-15 grams/liter

Boric Acid: 35-45 grams/liter

and having a pH between 3.5 and 4.0 with a maximum surface tension of 35 dynes/centimeter.

The anodes 30 and 32 are covered by non-conductive shields 46 and 48 respectively. These shields 46 and 48 may be of any plastic type material such as a vacuum formed polyvinylchloride to cover all 4 sides of the anode basket. The top and bottom of the anode basket need not be covered although the shields would normally also cover the bottom of the baskets.

A predetermined area of the surface of anode shield facing the printed circuit board cathode would be cut away to expose that predetermined area of the anode to the printed circuit board cathode. The smaller the exposed anode area, the greater the resistance of the plating system and the higher the voltage required for a given current density. For example, with an anode/cathode ratio of 1/3 6 volts were required whereas 1.6 volts were required for the factory recommended anode/cathode ratio of 3/1 to obtain the same current density.

As illustrated in FIG. 1, the redundant circuit side anode shield 46 includes two generally vertical rectangular openings. This produces a ratio of exposed anode area to cathode printed circuit board plated area of approximately 1/2. The cathode facing surface of the true circuit side anode shield, shown in FIG. 2, includes 5 circular openings with an anode-to-cathode ratio of approximately 1/8. Neither ratio includes the area of the nickel chips in the anode baskets but only the exposed anode basket area.

By providing each anode with a plastic shield having predetermined openings to expose only a portion of the anode to the cathode, a more uniform plated deposit can be achieved on the printed circuit board. Since the current is distributed more uniformly, extreme high and low current density areas can be eliminated. The cathode deflector rack with its inherent difficulties is no longer required.

Minimum tank voltage can be achieved by reducing the exposed anode area (increasing anode current density), allowing plating of cathodes having minimal areas, such as printed circuits. Whereas in conventional systems, with high ratio of anode area to cathode area, minimum voltage would not be obtainable without treeing the plated deposit on the higher current density areas.

By varying the openings of the shields on either side of the cathode printed circuit board, the rate of plating on opposite sides of the board can be separately controlled. In addition, changes in the location of the openings in the anode shields can be utilized to accommodate changes in the printed circuit board cathode configuration, shifting the plating deposit as required.

Most importantly the anode shields enable the voltage requirement for the needed current density to plate the nickel deposit to be raised. Maintaining this higher voltage level will increase the anode current density and produce a very ductile electroformed nickel tube which can be easily resistance welded to electronic component leads.

Although particular apparatus and procedures for carrying out the present invention have been illustrated and described, it is intended that these are provided by way of example only, the spirit and scope of this invention being limited only by the proper scope of the appended claims. 

What we claim is:
 1. An electroforming system comprising:a tank adapted to contain an electrolytic solution; means for supporting a printed circuit board cathode immersed in said electrolytic solution tank; anode means adapted to be immersed in said electrolytic solution tank in the vicinity of the supporting means and including a titanium wire anode basket for containing nickel chips, the material of which is to be electroformed on the cathode, and a non-conductive external shield disposed around the substantially enclosing the exterior of the anode basket, said external shield having a plurality of openings disposed in a predetermined pattern of shape and location on the side of said shield facing the cathode which is related to the configuration of the cathode; and means for directing a current between anode and cathode through said solution to electro-deposit nickel from the nickel chips on the cathode.
 2. The electroforming system of claim 1 wherein said electrolytic solution is a sulfamate nickel plating solution.
 3. The electroforming system of claim 2 wherein the ratio of exposed surface area of said anode to the surface area of said cathode is between 1 to 2 and 1 to
 8. 4. An electroforming system comprising:a tank adapted to contain an electrolytic solution; means for supporting a printed circuit board cathode immersed in said electrolytic solution tank; first anode means adapted to be immersed in said electrolytic solution tank in the vicinity of the supporting means along a first side thereof and including a first titanium wire anode basket for containing nickel chips, the material of which is to be electroformed on the cathode, and a non-conductive external shield disposed around and substantially enclosed the exterior of the anode basket, said external shield having a plurality of openings disposed in a first predetermined pattern of shape and location on the surface of said shield facing the cathode which is related to the configuration of the cathode adjacent the first anode means; second anode means adapted to be immersed in said electrolytic solution tank in the vicinity of the supporting means along a second side thereof remote from the first anode means and including a second titanium wire anode basket for containing nickel chips, the material of which is to be electroformed on the cathode, and a non-conductive external shield disposed around and substantially enclosing the exterior of the second anode basket, said external shield having a plurality of openings disposed in a second predetermined pattern of shape and location on the surface of said shield facing the cathode which is different from the first predetermined pattern; and means for directing respective currents between the anode means and the cathode through said solution to electrodeposit nickel from the nickel chips on the cathode.
 5. The electroforming system of claim 4 wherein said anode shields are vacuum formed polyvinylchloride.
 6. The system of claim 4 wherein the external shield of the first anode means provides an exposed area of the first anode means which is approximately one-half the area of the cathode adjacent the first anode means, and wherein the external shield of the second anode means exposes an area of the second anode means which is approximately one-eighth the area of the cathode adjacent the second anode means. 